发明名称 |
Cold plate structure and method for cooling planar arrays of processors during assembly and test allowing for single module site reworkability |
摘要 |
A method of cooling a module attached to a board by a spring mechanism that provides access to the module during testing. A cold plate assembly features a dry thermal interface coupled with spring loaded plunger to ensure a module, such as a dual chip module (DCM), for example, remains in place during individual cold plate removal.
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申请公布号 |
US7508676(B1) |
申请公布日期 |
2009.03.24 |
申请号 |
US20080101284 |
申请日期 |
2008.04.11 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SAMANIEGO PAUL;CAMPBELL LEVI;ELLSWORTH, JR. MICHAEL;DOMITROVITS MICHAEL;KELLEY PAUL;MAHANEY, JR. HOWARD |
分类号 |
H05K7/20;F28F7/00;H01L23/34;H05K7/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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