A multi-layer printed circuit board is provided to obtain the thin form and high intensity by heterogeneously forming the insulating layer for insulation function. The metallic pattern layer(10) is formed in one side or both sides of the insulating layer. The insulating layer is made of two different materials. The part of insulating layer(20) is made of the resin including glass fiber. The rest of insulating layer(30) is made of resin including carbon fiber, graphite fiber or their mixture. The rest insulating layer is made of multi-layers.
申请公布号
KR20090030139(A)
申请公布日期
2009.03.24
申请号
KR20070095487
申请日期
2007.09.19
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.;PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION
发明人
CHONG, MYUNG GUN;KIM, JUNG;KIM, SANG MOK;SONG, WOO JIN;KANG, BEOM SOO;YANG, DEK GIN;PARK, JONG WON;KO, TAE HO