| 摘要 |
A PCB pushing instrument for wire bonding equipment for semiconductor packages is provided to accurately supply the substrate by the push band. The substrate push apparatus(5) supplies one among the substrates laminated in the supply cassettes to the wire bonding machine. The push band(51) has the constant breadth and the length. The rotation roller rotates with the motor(521). The push band transfer apparatus(52) is formed in the perpendicular lower part of the rotation roller and opposite direction of the wire bonding machine. The push band transfer apparatus is comprised of two idle rollers(523). The horizontal guide part(531) guides the push band transferred to the push band transfer apparatus. The push band guide apparatus is comprised of the vertical guide part.
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