| 摘要 |
A manufacture method of a buildup circuit board is provided to increase economical efficiency by removing a high cost etching. In a manufacture method of a buildup circuit board, an inner layer wiring(2a) is formed on an internal layer resin(1). An insulation resin(11a) is adhered on the inner layer wiring, and a via hole(3) is formed at an insulation resin by laser irradiation. The surface of the insulation resin and the via hole are processed with a desmear, and a process and the electroless copper plating process of giving a catalyst(21) are performed. A resist(4) is plated on the electroless copper plating film(22), and the inner layer wiring(electricity copper plating membrane) is formed by processing the resist pattern as the electric copper plating mode.
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