| 摘要 |
A substrate processing apparatus is provided to prevent the damage of a substrate which is floated in a processing bath by inducing the substrate in the processing bath to be pushed. A wet etching apparatus(100) comprises a pump(10), a heater(20), a filter(30), a bubble remover(40), and a process bath(60). The process bath comprises an inner bath(50) and an outer container(55) and provides a space progressing for the etching process of a plurality of substrates(W). The inner bath supplies a space for an etchant(75) and has a sufficient volume to dip the substrates and the outer bath surrounds the inner bath. The etchant flowed out from the inner bath is received into the outer bath, and it is supplied to the inner bath through a second circulation line after the heat, the filer, and a bubble removing unit.
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