| 摘要 |
A method for treating a substrate is provided to prevent a process delay due to exchanging a process solution by exchanging a first process solution and a second process solution at the same time. A process for a first wafer is completed in a first process bath(114), and a second process bath(116) process the first wafer. A second wafer(W2) stays the buffer(112) temporarily, and the first water is transferred to a next process. A second process solution is exchanged at the second process bath. At that time, a first process solution is exchanged in the first process bath.
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