| 摘要 |
The present invention provides a thermocompression bonding head, which can mount electric components on a wiring board in a short time with high connection reliability, and provides a mounting device using the same. A thermocompression bonding head (3) comprises an elastic pressure-bonding member (7) formed of an elastomer provided in a heatable metal head body (5). A metal pressing member (5b) corresponding to an electric component (20) as a target to be thermocompression bonded is provided integrally in the head body (5), and an elastic pressure-bonding member (7) is mounted on the head body (5) so that the metal pressing member (5b) in its pressing surface (50) is exposed in a recessed state on the periphery of the metal pressing member (5b). The head body (5) comprises a frame-shaped member having a concave part (5a), and the metal pressing member (5b) is integrally formed in the concave part (5a) in the head body (5). Further, the elastic pressure-bonding member (7) is housed and mounted in the concave part (5a). |
