ELECTRONIC COMPONENTS EMBEDDED PCB AND METHOD FOR MANUFACTURING THEREOF

摘要

An electronic components embedded PCB and method for manufacturing thereof are provided to easily form the via by forming the first electric component and the second electric component in the cavity of the insulating substrate. The cavity(115) is formed in the one side of the insulating substrate(110). The first electric component(120) is inserted into the cavity in order to face electrodes(122,132) at the one side of the insulating substrate. The second electric component(130) is laminated in the one side of the first electric component. The first insulation layer(140) is formed in the one side of the insulating substrate in order to cover the second electric component. The electric component-built-in printed circuit board including the second insulation layer(145) is formed in the other side of the insulating substrate in order to cover the first electric component.