发明名称 LAYUP APPARATUS FOR COPPER CLAD LAMINATE AND METHOD THEREOF
摘要 A layup apparatus for copper clad laminate and method thereof are provided to reduce the establishment area of the copper-clad laminate laying apparatus and to reduce the work time. The sus plate supplying port(100) vacuum-absorbs the laminated sus plate(2) to transfer. The copper foil hole presentation is comprised of the upper clad laminate supplying port(210) and lower side copper laminate supplying port(220). The combiner(300) disposes the upper and lower side copper laminate(3)(1) in the upper and lower side of the sus plate to form the copper clad plate. The transfer chuck king part(450) transfers the copper clad plate by chucking to the outer side. The lower copper laminate transfer apparatus(222) supplies the lower side copper laminate to the combiner.
申请公布号 KR20090029462(A) 申请公布日期 2009.03.23
申请号 KR20070094720 申请日期 2007.09.18
申请人 ACEN-HITECH CO., LTD. 发明人 LEE, BONG WON
分类号 H05K13/02 主分类号 H05K13/02
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