发明名称 LAYUP BOARD AND CORE BOARD SUPPLY APPARATUS
摘要 A lay up substrate and core substrate supplying apparatus are provided to improve the separability of the core substrate by transferring the core substrate one by one to the determined location. The insulating layer is arranged in the lay up substrate. The lay up substrate is put into the zig-zag type in the upper side and lower side of the core substrate. The lifting device(110) moves the lay up substrate to the top. The zigzag separation devices(120,130) are positioned at both sides of the lifting device. The transfer apparatus(150) rearwards transfers of the first lay up substrate. The separator(121) is inserted to the interval of the second lay up substrate and the first lay up substrate. The chucker(123) is arranged on the top of separator.
申请公布号 KR20090029461(A) 申请公布日期 2009.03.23
申请号 KR20070094719 申请日期 2007.09.18
申请人 ACEN-HITECH CO., LTD. 发明人 LEE, BONG WON
分类号 H05K13/02 主分类号 H05K13/02
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