LIGHT EMITTING DIODE PACKAGE

摘要

A light emitting diode package capable of obtaining desired light emitting color by converting wavelength with phosphor powder is provided to prevent direct contact of a LED chip and a phosphor powder by forming a micro lens between molding material including the LED chip and the phosphor powder. A lead frame(150) includes a pair of lead terminals. A part of the lead frame is loaded in an inner side of a package(110). The package includes an opened radiation window in order to radiate a light. A LED chip(130) is mounted on the lead frame inside the package. A micro lens surrounds the LED chip. An electrode connection part(140) is made of a conductive adhesive or a bump ball in order to conduct the LED chip and the lead frame. Molding material(200) is filled between an outer part of the micro lens and an inner part of the package, and contains a phosphor powder.