<p>A soft stamping device is provided to control the displacement and load with the high precision and to easily form the micro-pattern. The stamp is connected in the stamp chuck. The stamp chuck is combined to the frame. The frame supports the stamp chuck to the set-up height. The substrate chuck(150) is located in the lower part of the stamp chuck. The displacement movement part(160) is arranged in the lower part of the substrate chuck and elevates the substrate chuck. The location alignment monitoring part is positioned on the top of the stamp chuck and grasps the location of substrate and stamp. The operation control part operates the displacement movement part according to the grasped location information.</p>
申请公布号
KR20090027403(A)
申请公布日期
2009.03.17
申请号
KR20070092598
申请日期
2007.09.12
申请人
DCN CO., LTD.;KOREA INSTITUTE OF MACHINERY & MATERIALS
发明人
BYUN, CHAY WAN;SHIN, KWAN WOO;KIM, YONG TAE;PARK, SUNG UN;KU, JA YUN;JO, JEONG DAI