SUBSTRATE AND MANUFACTURING METHOD THEREOF

摘要

A substrate and a manufacturing method thereof are provided to improve the etching factor by controlling the size of the grain per the unit volume within the conductive layer. The conductive layer is formed on the one side of the base material. The formation of the conductive layer is performed after forming the first metal layer on the one side of the base material(S310) and forming the second metal layer on the one side of the first metal layer into the plating process(S320). The grain number per the unit volume of the first metal layer and the second metal layer is controlled by changing the chemical composition of the plating liquid used in the plating process. The etching resist pattern is formed on the one side of the conductive layer(S330). The conductive layer is etched and the circuit pattern is formed(S340).