| 摘要 |
A resin composition for optical-semiconductor encapsulation, characterized by comprising the following ingredients (A) and (B). It is excellent in light-transmitting properties, ultraviolet resistance, and heat resistance. (A): a (meth)acrylic polymer having epoxy groups and (B) : at least one hardener selected from the group consisting of the following ingredients (b1) to (b4), (b1) a polycarboxylic acid, (b2) a polycarboxylic acid anhydride, (b 3) a product of the reaction of a polycarboxylic acid with a compound represented by the general formula (B-1), and (b4) a product of the reaction of a polycarboxylic acid anhydride with a compound represented by the general formula (B-2). |
