| 摘要 |
Provided is a lead-in structure of a front console side panel for guiding the assembly thereof to a driver side lower panel. The lead-in structure includes a substrate having an elongated aperture and a plurality of lead-in bumps, whereas the lead-in bumps are spaced apart and aligned in a direction substantially parallel to the longitudinal axis of the aperture. The lead-in bumps collectively have a lead-in surface and are connected onto the substrate and separated from the aperture by a distance. The lead-in bumps optionally are merged to form a singly elongated bump. The angle between the lead-in surface and the aperture is greater than 90 degree, preferably greater than 110 degrees, and more preferably greater than 130 degrees. The number of the lead-in bumps aligned is an integer between 2 and 10. Alternatively, the lead-in bumps are resiliently deformable so as to minimize contact friction during panel assembly. Optionally, the lead-in bumps are made integral to the substrate and the substrate is made of a material illustratively including a metal, a polymer, a resin, a ceramic, or any combination thereof. The lead-in structure optionally further includes a separation rib to provide clearance between the front console side panel and the driver lower panel upon panel assembly.
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