A carrier for a semiconductor chip is provided to prevent the electrode of the semiconductor chip package from being sandwiched in the semiconductor chip carrier. The semiconductor chip package(30) has the BGA type including the terminal(32). The ball guide(40) is integrally combined with the seating opening of the base(10). The ball guide is formed with insulator. The ball guide is extended to the inner side of the opening and is protruded from the inner circumference of the seating opening. The ball guide forms one or more closed loop. The closed loop surrounds one or more terminal.
