| 摘要 |
A slurry composition for chemical mechanical polishing is provided to ensure little scratch, high polishing speed to the insulating layer, and stability of the slurry. A slurry composition for chemical mechanical polishing for insulation layers comprises silica as an abrasive, a polishing accelerant, a pH adjusting agent and deionized water. The polishing accelerant is one or more mixtures selected from the group consisting of an organic acid, inorganic acid, amino acid, chelating agent and their salt.
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