| 摘要 |
A method of manufacturing the semiconductor die having the inclined edge for accommodating the electrical connector is provided to omit the vertical space for the wire bonding by forming directly electric traces on the surface of the semiconductor die. The die bond pad(104) is formed in the surface of the semiconductor die(102). The sloped edge(106) is formed on the semiconductor die. The sloped edge accommodates the electrically conductive trace. The semiconductor die is cut down according to the first edge of the semiconductor die from the wafer. Therefore, the semiconductor package having low profile can be manufactured. |
