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发明名称
晶粒堆叠系统及方法
摘要
本发明揭示一种晶粒堆叠系统及方法。在一实施例中,一晶粒具有一表面,该表面包括一钝化区域、至少一导电结合衬垫区域及一经定尺寸以容纳至少一第二晶粒之导电堆叠晶粒容纳区域。
申请公布号
TW200913176
申请公布日期
2009.03.16
申请号
TW097118256
申请日期
2008.05.16
申请人
高通公司
发明人
亨利 山雀斯;雷斯米纳瑞扬 沙尔玛
分类号
H01L23/02(2006.01);H01L25/00(2006.01)
主分类号
H01L23/02(2006.01)
代理机构
代理人
陈长文
主权项
地址
美国
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