| 摘要 |
<p>A semiconductor package is provided to improve the operation speed of the semiconductor package by decreasing a signal transmission path between the semiconductor chip and the substrate. A semiconductor package(400) is composed of a first semiconductor chip(100) and a second semiconductor chip(200). The first semiconductor chip includes a semiconductor body(110) having a first circuit region and peripheral area, a fist bonding pad group including a plurality of bonding pads, and a first re-wiring group. The second semiconductor chip is compose of the second semiconductor body(210), a second bonding pad group(220), and a second re-wring group(230).</p> |
