| 摘要 |
A substrate used for fabricating a semiconductor package and a method for manufacturing the same are provided to efficiently emit the heat generated from the semiconductor package by forming a path way for heat from the semiconductor chip to a solder ball using a metal layer. A plurality of holes(H) are formed inside a metal plate(210). An insulating layer is formed at upper side and lower side of the metal plate. The hole is reclaimed by insulating layers(220a,220b). The first metal layers(230a,230b) are formed in each of the insulating layers. A plurality of penetration hole(V) are formed in the first metal layer and the insulating layer. The second metal layer(240) is formed on the first metal layer. A solder mask(250) is formed in order to reclaim the penetration hole and the groove of each second metal layer.
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