| 摘要 |
A substrate used ball grid array package and method of fabricating the same is provided to improve the stress value of the solder ball and prevent a crack due to the difference of the thermal tension of the solder resist. A substrate used ball grid array package and method of fabricating the same is comprised of the steps: forming a protective film(203) surrounding ball land on a insulation layer in which a wring including the ball land(204); coating a solder resist(206) on the insulating layer including protective film; etching a solder resist to expose a portion of protective film on the ball land; removing the exposed protective film to overlap with the edge of the ball land while allowing the solder resist to expose the upper and side or the ball land. |
