| 摘要 |
<p>A method for separating protective tape and apparatus for separating protective tape are provided to use the exfoliating tape having the adhesive force which is stronger than the protection tape. The protection tape is adhered to the wafer. Moreover, the wafer is replaced in the exfoliation table. The exfoliating tape is rolled with the adhesive member. The surface height of the protection tape is detected(S5). The operative amount of the adhesive member for approaching the protection tape based on the detected information is calculated(S6). The exfoliation table is moved along the side of the protection tape based on the calculated operation volume(S7). Consequently, the exfoliating tape and protection tape are exfoliated from the surface of wafer.</p> |
