| 摘要 |
A cooling unit for semiconductor module is provided to allow a user to mounting the semiconductor module to various electronic products regardless of the size of the cooling unit. In a cooling unit for semiconductor module, a first cold body having plate-like(110), a second cooling body(120) opposite directions to the first cold body, a cooling member(130) interposed between the first and the second cold body. A cooling member of which volume is adjusted to control the interval between the first and second cooling body includes a first cooling member(131), a second cooling member(132) and adhesive member(133). An adhesive member is interposed between the first and the second adhesive part. |
