| 摘要 |
A diamond electro-deposited wire saw is provided to select the thickness of wafer according to the particle size of diamond. A diamond electro-deposited wire saw(112) comprises: a strike plating layer attached on wire(110) in order to activate the surface of the wire; a diamond-nickel plating layer attached on the strike plating layer in order to contain the powder of diamond and nickel; a nickel plating layer attached on the diamond-nickel plating layer and mixed with the Ni powder; and a cobalt coating layer attached on the nickel plating layer and mixed with the cobalt powder.
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