| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring substrate which is electromagnetically superior and also superior in heat dissipation and has via holes with high connection reliability, by controlling the thickness of a second insulating layer on the wiring patterns, while taking into account the area ratio of the second insulating layers for buring wiring patterns and all the wiring patterns having a signal pattern and a dummy pattern, and to provide a manufacturing method therefor. SOLUTION: Disclosed is the multilayer wiring substrate is such that a plurality of insulating layers each has first and second insulating layers which are two kinds of insulating layers differing in material composition and a via hole penetrating them; a plurality of wiring layers each having a wiring pattern, that has a wiring gap of 20 to 300μm with a land pattern into a desired shape for connecting to a wiring pattern included in a different wiring pattern through a via hole; a dummy pattern, disposed in the gap of the wiring pattern and are each covered with a second insulating layer; and a second insulating layer formed on the land pattern is 2 to 12μm in thickness. COPYRIGHT: (C)2009,JPO&INPIT |
