发明名称 MONITORING METHOD, MONITORING DEVICE AND MONITORING PROGRAM OF MANUFACTURING PROCESS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a monitoring method of a manufacturing process, capable of automatically detecting an executing time of maintenance of a manufacturing device. SOLUTION: Wavelet transform signal are obtained for a plurality of frequency bands by executing wavelet transform to a measurement signal output from an LSI manufacturing device (S3). When the wavelet transform signals for al the frequency bands are not smaller than a threshold value, it is determined that the maintenance of the manufacturing device has been executed, and in the cases other than that, it is determined that the maintenance has not been executed (S4). When it is determined that the maintenance has been executed, an alarm is not issued (S5), and a new management range is set based on a measurement signal output after the maintenance (S6). When it is determined that the maintenance has not been executed, whether the measurement signal is within the management range is determined (S7), and it is determined that abnormality has occurred in the manufacturing device when the measurement device is not within the management range, and an alarm is issued (S8). COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009054766(A) 申请公布日期 2009.03.12
申请号 JP20070219664 申请日期 2007.08.27
申请人 TOSHIBA CORP 发明人 ASAGARA TAKASHI
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
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