| 摘要 |
PROBLEM TO BE SOLVED: To improve a grounding structure of an electronic device, improving assembly workability and reducing cost. SOLUTION: A window 10 for a grounding spring is provided on a rear end of a case 8, a printed board 9 having a grounding spring 12 mounted by a mounting spring 13 is inserted from a front end of the case 8 to form a module 16. The grounding spring 12 is projected from the window 10 for a grounding spring. A base 15 is mounted on the rear end of the case 8, and a grounding part 15b of the base 15 is made in contact with the grounding spring 12 projected from the window 10 for a grounding spring. COPYRIGHT: (C)2009,JPO&INPIT
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