| 摘要 |
PROBLEM TO BE SOLVED: To form a thin film having desired film thickness distribution on a disk substrate. SOLUTION: A recording region 10a of a disk substrate 11 is sputtered while a shielding member 50A whose shape is formed based on film thickness distribution of the thin film to be formed on the disk substrate is disposed between the disk substrate 11 which is rotated and a sputtering target 25. Thereby, a portion of particles emitted from the sputtering target 25 is shielded based on the film thickness distribution of the thin film to be formed and the thin film of the desired film thickness distribution is formed in the recording region 10a on the disk substrate 11. COPYRIGHT: (C)2009,JPO&INPIT
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