发明名称 Method and Apparatus for Plasma Processing
摘要 An object of the invention is to provide a method and an apparatus for plasma processing which can accurately monitor an ion current applied to the surface of a sample. Predetermined gas is exhausted via an exhaust port 11 by a turbo-molecular pump 3 while introducing the gas within the vacuum chamber 1 from a gas supply device 2, and the pressure within the vacuum chamber 1 is kept at a predetermined value by a pressure regulating valve 4. A high-frequency power supply 5 for a plasma source supplies a high-frequency power to a coil 8 provided near a dielectric window 7 to generate inductively coupled plasma within the vacuum chamber 1. A high-frequency power supply 10 for the sample electrode for supplying the high-frequency power to the sample electrode 6 is provided. A matching circuit 13 for the sample electrode and a high-frequency sensor 14 are provided between the sample electrode high-frequency power supply and the sample electrode 6. An ion current applied to the surface of a sample can be accurately monitored buy using the high-frequency sensor 14 and an arithmetic device 15.
申请公布号 US2009068769(A1) 申请公布日期 2009.03.12
申请号 US20060887821 申请日期 2006.04.04
申请人 OKUMURA TOMOHIRO;SASAKI YUICHIRO;OKASHITA KATSUMI;ITO HIROYUKI;MIZUNO BUNJI;JIN CHENG-GUO;NAKAYAMA ICHIRO 发明人 OKUMURA TOMOHIRO;SASAKI YUICHIRO;OKASHITA KATSUMI;ITO HIROYUKI;MIZUNO BUNJI;JIN CHENG-GUO;NAKAYAMA ICHIRO
分类号 H01L21/66;G21K5/00 主分类号 H01L21/66
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