发明名称 MOUNTING STRUCTURE, MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To improve joint strength by achieving highly precise positioning. <P>SOLUTION: An electrode part 14 is poured in the inside of a through-hole 12 while correcting its position with respect to the through-hole 12 in a self-aligning manner, and the poured-in electrode part 14 fits integrally in the inside of the through-hole 12. An electrode part 15 is joined to an electrode terminal 13 while correcting its position with respect to the electrode terminal 13 in a self-aligning manner, and an electronic component 16 is mounted on a circuit board 11. Consequently, the position of the electrode part 14 with respect to the through-hole 12 is easily corrected with high accuracy, and the poured-in electrode part 14 fits integrally and strongly in the inside of the through-hole 12. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009054611(A) 申请公布日期 2009.03.12
申请号 JP20070216942 申请日期 2007.08.23
申请人 FUJITSU LTD 发明人 MIZUTANI DAISUKE
分类号 H01L21/60 主分类号 H01L21/60
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