SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device for inhibiting a warp from occurring when wire-bonding on a protrusion of a semiconductor element to be laminated and having a carrying member not to upsize the semiconductor device, and also to provide its manufacturing method.

SOLUTION: The semiconductor device to solve the problem includes: a supporting base having an electrode terminal provided; an intermediate member mounted on the supporting base; a semiconductor element partially supported by the intermediate member and provided on the supporting base; and a protruding member provided on the supporting base or the intermediate member corresponding to an electrode terminal of the semiconductor element. The electrode terminal of the semiconductor element and the electrode terminal on the supporting base are connected via a bonding wire.

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