| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric device capable of sufficiently keeping air-tightness and a manufacturing method thereof. SOLUTION: A manufacturing method of a piezoelectric device 100 includes: a step of providing a wax material 77 containing an AuSn alloy layer and an Ni layer between a base 61 on which a piezoelectric vibrating chip 10 is fixed and a cover 72, and a step of fixing the cover onto the base using the wax material, wherein the fixing step includes a step of heating the wax material 77 to fuse the No layer and the AuSn alloy layer and mutually diffusing the Ni layer and the AuSn alloy layer to form an NiSn layer and an AuSn alloy layer ofζphase, wherein heating is one of the types of heating at a temperature of 340 to < 360°C for 30 minutes or longer, heating at a temperature of 360 to < 400°C for 10 minutes or longer, and heating at≥400°C for 5 minutes or longer. COPYRIGHT: (C)2009,JPO&INPIT
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