发明名称 MOBILE DEVICE HAVING HEAT DISSIPATION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a heat radiation structure whose thickness to be felt is mitigated even when touched by the finger of a user. SOLUTION: For a digital camera, a metallic tripod seat 3 is provided on a cabinet 1, a circuit component 6 generating heat is housed inside the cabinet 1, the circuit component 6 is connected with the tripod seat 3 so as to conduct heat, and a cover 2 made of a resin and extended from the cabinet is put on the tripod seat 3. Also, the tripod seat 3 is provided on one end of the cabinet 1, the outer surface of the cabinet 1 forms a projected surface 40 at a part facing the circuit component 6, and a gap 41 allowing heat transfer to the other end of the cabinet 1 is formed between the surface 40 and the circuit component 6. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009055260(A) 申请公布日期 2009.03.12
申请号 JP20070219209 申请日期 2007.08.27
申请人 SANYO ELECTRIC CO LTD 发明人 SASAKI YOSHIKAZU
分类号 H04N5/225;G03B17/02;G03B17/55;G03B17/56 主分类号 H04N5/225
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