Verfahren zum Herstellen eines festen Leistungsmoduls und damit hergestelltes Transistormodul

摘要

The method involves producing an integrated punched grid. The punched grid is assembled with semiconductor components, possible passive assembly parts and bonding corresponding connections. The recesses at predetermined positions remain in the envelop in the power module during enveloping. A subsequent cutting out of bars of integral punched grid takes place through the mounting die inserted in the recesses, by producing electrically insulated islands of punched grid material of the integral punched grid.