| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition which catches moisture and does not re-release the caught moisture. <P>SOLUTION: The epoxy resin composition contains a liquid epoxy resin, a UV-cationic curing initiator or thermal-cationic curing initiator, and an alkaline earth metal oxide such as calcium oxide or barium oxide. A resin-sealed device obtained by sealing an electrode material or a light-emitting device with the resin composition is also provided. Since the moisture having intruded inside an electronic component device is trapped by an alkaline earth metal oxide dispersed in a cured body of the epoxy resin composition when the moisture comes into contact with the oxide, an electronic device at the inside of the electronic component can be prevented from deterioration or corrosion. <P>COPYRIGHT: (C)2009,JPO&INPIT |
