| 摘要 |
PROBLEM TO BE SOLVED: To provide substrate treating equipment and a substrate treating method for allowing a substrate to be suitably subjected to treatment using a dilution chemical, avoiding having a bad influence on a metal film. SOLUTION: If a hydrofluoric acid front surface side valve 23 and a third carbonic water valve 24 are opened, hydrofluoric acid (a hydrofluoric acid undiluted solution) from a hydrofluoric acid supply source and carbonic water from a carbonic water supply source flow into a second mixture unit 32. Hydrofluoric acid and carbonic water are mixed in the second mixture unit 32. Therefore, hydrofluoric acid is diluted with carbonic water and a predetermined density (for example, 0.016-0.05 wt.%) of dilute hydrofluoric acid is prepared. Dilute hydrofluoric acid supplied to a dilute hydrofluoric acid nozzle 4 through a dilute hydrofluoric acid front surface side supply pipe 20 is supplied to the front surface of a substrate W during rotation from the dilute hydrofluoric acid nozzle 4. Dilute hydrofluoric acid from the dilute hydrofluoric acid nozzle 4 has a relatively low specific resistance. COPYRIGHT: (C)2009,JPO&INPIT
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