发明名称 Heat sink for an electrical device and method of manufacturing the same
摘要 A heat sink for an electrical device has a frame and at least one fin. The frame has an inner chamber. The fin is mounted in the inner chamber of the frame to separate the inner chamber of the frame into at least two channels. Therefore, heat generated from any electrical element connected to or mounted on the heat sink will transfer evenly to the heat sink. The heat sink not only dissipates heat evenly, but also provides multiple channels to dissipate heat by convection. Because the heat sink only has one frame, assembly of an electrical device is easy and quick.
申请公布号 US2009065174(A1) 申请公布日期 2009.03.12
申请号 US20070898090 申请日期 2007.09.10
申请人 LAI YU-JEN;SU SONG-KAI 发明人 LAI YU-JEN;SU SONG-KAI
分类号 F28F7/00 主分类号 F28F7/00
代理机构 代理人
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