| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin-made hollow package with an excellent heat radiation property. <P>SOLUTION: In order to improve the heat radiation property of the resin-made hollow package for accommodating solid-state imaging elements such as a CCD, a CMOS or the like, an island is exposed on an internal surface of a hollow part bottom in a portion adjacent to a connection terminal region of the element and other intermediate portions are bent and exposed in a compact of the hollow part bottom or on an external surface of the hollow part bottom. Thereby, there is proposed such a package structure that prevents an unnecessary light reflecting to a pixel region and has a high heat radiation property. <P>COPYRIGHT: (C)2009,JPO&INPIT |
