| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a flexible substrate for an electronic device, a manufacturing method for an electronic device, and the electronic device manufactured by the method. <P>SOLUTION: The manufacturing method manufactures the flexible substrate for the electronic device which includes at least a barrier layer and a flattened layer on the flexible support wherein the flattened layer has at least a thermosetting resin layer. The manufacturing method includes a step of forming the barrier layer on the flexible substrate, and a step of setting the thermosetting resin layer facing the barrier layer and putting both the layers closely together by heat to form the flattened layer. The manufacturing method for the electronic device and also the electronic device manufactured by the method are also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
