发明名称 |
INTERPOSER FOR CONNECTING PLURALITY OF CHIPS AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.
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申请公布号 |
US2009064496(A1) |
申请公布日期 |
2009.03.12 |
申请号 |
US20080273550 |
申请日期 |
2008.11.19 |
申请人 |
HUANG KUAN-JUI;WANG CHANG-PING;LI HSIU-MING;HUANG SHIH-MIN;KUO HUI-CHEN;CHEN CHIA-CHUN |
发明人 |
HUANG KUAN-JUI;WANG CHANG-PING;LI HSIU-MING;HUANG SHIH-MIN;KUO HUI-CHEN;CHEN CHIA-CHUN |
分类号 |
H05K3/10 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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