| 摘要 |
The fabrication method of an organic substrate having embedded active-chips such as semiconductor chips is disclosed. The present invention previously applies the conductive adhesives in a wafer state, makes them in a B-stage state, obtains individual semiconductor chips through dicing, and positions the individual semiconductor chips previously applied with the conductive adhesives in the cavities, making it possible to simultaneously obtain an electrical connection and a physical adhesion of the substrate and the semiconductor chips by means of a method of applying heat and pressure and stack the copper clad laminates on the upper portion of the substrate to which the semiconductor chips are connected. The present invention has advantages in processes such as a lead-free process, an environmental-friendly fluxless process, a low temperature process, ultra-fine pitch applications, etc., by mounting the active-chips through the flip chip interconnection using the non-solder bumps and the conductive adhesives. |
