| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve a problem that an electronic part having an electrode on the bottom is not attached to a printed wiring substrate. <P>SOLUTION: A printed wiring substrate 10 including a substrate electrode is configured so that a substrate electrode 12 has a substrate electrode mount part 14 that mounts by soldering a bottom electrode 22 arranged inside the outer edge of an electronic part 20 and on the bottom of the electronic part 20 and, at the same time, located inside the outer edge of the electronic part, and a projection part 13 projecting from the substrate electrode mount part 14, narrower in width than the substrate electrode mount part 14, and connected to the wire of the printed wiring substrate 10. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
