发明名称 PACKAGE FOR MICROMIRROR DEVICE
摘要 The present invention discloses a mirror device that includes a mirror element which further comprising an elastic hinge and a mirror and which modulates incident light emitted from a light source, a device substrate on which a drive circuit for driving the mirror element is placed, a package substrate which is made of transparent glass or a silicon material and on which the device substrate is placed, a metallic thermal transfer path connected to the device substrate, and a cover glass connected to the package substrate so that the device substrate is covered.
申请公布号 WO2009032344(A1) 申请公布日期 2009.03.12
申请号 WO2008US10554 申请日期 2008.09.06
申请人 OLYMPUS CORPORATION;SILICON QUEST KABUSHIKI-KAISHA;ISHII, FUSAO 发明人 ISHII, FUSAO;MAEDA, YOSHIHIRO;NISHINO, HIROKAZU;SHIRAI, AKIRA;ICHIKAWA, HIROTOSHI
分类号 H01L21/00 主分类号 H01L21/00
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