发明名称 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition which is applicable even to a multiple exposure process in which exposure is performed two or more times on the same resist film, and which ensures a fine pattern profile, and to provide a pattern forming method. <P>SOLUTION: The positive resist composition includes: (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (B) a resin of which solubility in an alkali developer increases under an action of an acid; (C) a compound capable of decomposing under an action of an acid to generate an acid; and (D) a compound which itself acts as a base for the acids generated from the component (A) and the component (C) but decomposes upon irradiation with actinic rays or radiation to lose a basicity for the acids generated from the component (A) and the component (C). The pattern forming method uses the positive resist composition. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009053688(A) 申请公布日期 2009.03.12
申请号 JP20080195372 申请日期 2008.07.29
申请人 FUJIFILM CORP 发明人 TARUYA SHINJI;TSUBAKI HIDEAKI;WADA KENJI
分类号 G03F7/004;C08F220/10;G03F7/039;H01L21/027 主分类号 G03F7/004
代理机构 代理人
主权项
地址