| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering method capable of soldering a plurality of electronic components onto a substrate using a light radiation part as a heat source while a temperature of a soldered part to which the respective electronic components are soldered is controlled to a predetermined temperature suitable for soldering by a simple structure. SOLUTION: In the soldering method for soldering a plurality of electronic components 12 onto a circuit board 11, the light radiation part 30 is used as a heat source, a plurality of soldered parts on the circuit board 11 are concurrently irradiated, and light reception amount control members (positioning tools 17a-17c) are provided on the plurality of soldered parts to raise the temperature of the soldered parts to a predetermined temperature. By changing a light reception area of the light reception amount control member, the temperature of each soldered part is controlled to be the predetermined temperature. COPYRIGHT: (C)2009,JPO&INPIT |
