发明名称 Method for Measuring Sample, Package for Sensor Chips, and Mechanism for Fixing Sensor Chips
摘要 A method for measuring samples includes fitting and mounting, onto a transfer stage, a chip pallet for transporting sensor chips; fitting a positioning hole of a chip package onto a positioning pin; pulling a bottom plate of the chip package off the chip package, so as to simultaneously transfer the housed sensor chips onto the transfer stage; pulling upward the chip pallet so as to simultaneously transfer, onto the chip pallet, the sensor chips on the transfer stage; and mounting the chip pallet having the sensor chips mounted thereon onto a measuring device, and measuring samples.
申请公布号 US2009064802(A1) 申请公布日期 2009.03.12
申请号 US20080206032 申请日期 2008.09.08
申请人 UCHIYAMA KENICHI;TAKASE TOMOHIRO;UEMATSU IKUO;KASAI SHINGO 发明人 UCHIYAMA KENICHI;TAKASE TOMOHIRO;UEMATSU IKUO;KASAI SHINGO
分类号 G01N33/00;B23P19/00;H01L29/00 主分类号 G01N33/00
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