发明名称 |
Method for Measuring Sample, Package for Sensor Chips, and Mechanism for Fixing Sensor Chips |
摘要 |
A method for measuring samples includes fitting and mounting, onto a transfer stage, a chip pallet for transporting sensor chips; fitting a positioning hole of a chip package onto a positioning pin; pulling a bottom plate of the chip package off the chip package, so as to simultaneously transfer the housed sensor chips onto the transfer stage; pulling upward the chip pallet so as to simultaneously transfer, onto the chip pallet, the sensor chips on the transfer stage; and mounting the chip pallet having the sensor chips mounted thereon onto a measuring device, and measuring samples.
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申请公布号 |
US2009064802(A1) |
申请公布日期 |
2009.03.12 |
申请号 |
US20080206032 |
申请日期 |
2008.09.08 |
申请人 |
UCHIYAMA KENICHI;TAKASE TOMOHIRO;UEMATSU IKUO;KASAI SHINGO |
发明人 |
UCHIYAMA KENICHI;TAKASE TOMOHIRO;UEMATSU IKUO;KASAI SHINGO |
分类号 |
G01N33/00;B23P19/00;H01L29/00 |
主分类号 |
G01N33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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