| 摘要 |
The invention relates to a mounting device for solar wafers (2), comprising at least one comb-like holder (1) having an elongated web (3), on which along the longitudinal extension thereof a plurality of comb elements (4) arranged at equal distances from each other are provided, wherein between the surfaces of neighboring comb elements (4) facing each other at least one recess (5 or 6) is formed, which comprises a contact surface (7) and a guiding surface (8) for the solar wafer (2) to be inserted into the recess (5 or 6). For the secure holding and mounting of the solar wafer in the mounting device, a mounting gap (9) is provided between the neighboring comb elements (4) of the elongated web (3) of the at least one comb-like holder (1), wherein the outer contour (us) of said gap comprises the contact surface (7) and the guiding surface (8), having an arbitrary width (bH) of two recesses (5 and 6) that are offset from each other, the depths (t1) or (t2) thereof being smaller than the total depth (tges) of each comb element (4), wherein the depth (t1) and the depth (t2) together form the total depth (tges) of each comb element (4), and the outer contour (uA1 or uA2) of the recesses (5 or 6) comprises a groove (10) having a slanted surface section (11) on the web side that is located in a plane (12) running in an inclined manner to the plane (13) of the support surface (7) of the outer contour (us) of the mounting gap (9) such that when the bottom edge (21) of the solar wafer (2) and the slanted surface section (11) of the groove (10) of the outer contour (uA1 or uA2) become engaged it is glidingly displaced into a predetermined position due to gravity. In said position, upon rotating the comb-like holder (1) about a predetermined acute angle (f) to the vertical line on the support surface (7) of the outer contour (us) of the mounting gap (9), the solar wafer (2) is brought with the surface (13) thereof facing the support surface (7) in planar contact with the support surface (7). At the same time, a tolerance (14) between the surface (22) of the solar wafer (2) facing away from the support surface (7) and the guiding surface (8) of the outer contour (us) of the mounting gap (9) extending parallel to the support surface (7) is provided in said position.
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