| 摘要 |
PROBLEM TO BE SOLVED: To improve the conductive reliability under the thermal cycling environment in a multilayer wiring board employing a structure wherein the interlayer conduction is obtained with conductive paste filled into a via hole. SOLUTION: This invention is a multilayer wiring board, wherein conductor layers 12a, 12b are arranged at both sides of an insulating substrate 11 and are electrically connected with each other through a conductive paste layer 15 that is filled into a via hole 14 on a laminated plate 20. First and second conductive pastes 16, 17 are filled in laminae along the radial direction of the via hole 14 to form many connection interfaces extending in the depth direction of the via hole 14. COPYRIGHT: (C)2009,JPO&INPIT |
