| 摘要 |
PROBLEM TO BE SOLVED: To provide a fluorescent X-ray analysis method which enables the precise analysis of the elements contained in a target member, even if a substance that obstructs measurement (interefering substance) is present in the vicinity of or under the target member, and to provide a fluorescent X-ray analyzer that realizes the fluorescent X-ray analysis method. SOLUTION: For example, when the content of Pb in the tin plating film (soldering) of the electrode part of a chip resistor is measured, an X-ray beam with a diameter of 10-100μm is scanned, to detect the distribution of Sn, Ag and Si contained in the chip resistor. The distribution of Sn shows the existing area of the tin plating film, the distribution of Ag shows the existing area of a substrate film comprising the lead glass-containing Ag film provided to the lower layer of an Sn plating film, and the distribution of Si shows the existing area of the protective film comprising lead glass adjacent to an electrode to cover the chip resistor. The optimum measuring point, where only Sn exists, is extracted from the image, showing those distribution states and irradiated with the X-ray beam to measure the content of Pb in the Sn plating film. COPYRIGHT: (C)2009,JPO&INPIT
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